在AI算力基础设施投资如火如荼的当下,共封装光学(CPO)技术却被行业巨头集体"降温"。博通首席执行官陈福阳在最新财报会议上直言"硅光子学短期内不会在数据中心发挥实质性作用",Arista、Marvell等厂商一致认为CPO的商业化时间表将推迟至2028-2029年。这一共识背后,是行业对现有互联技术潜力的重新评估——可插拔光模块、线性驱动可插拔光模块(LPO)等过渡方案正展现出超预期的生命力,而...
Source Link在AI算力基础设施投资如火如荼的当下,共封装光学(CPO)技术却被行业巨头集体"降温"。博通首席执行官陈福阳在最新财报会议上直言"硅光子学短期内不会在数据中心发挥实质性作用",Arista、Marvell等厂商一致认为CPO的商业化时间表将推迟至2028-2029年。这一共识背后,是行业对现有互联技术潜力的重新评估——可插拔光模块、线性驱动可插拔光模块(LPO)等过渡方案正展现出超预期的生命力,而...
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