在半导体行业,每一次工艺突破,都会带来算力的跃迁。但当先进制程越走越窄,我们必须承认:未来真正的技术红利,可能不是来自晶体管,而是来自“整合”。在IEEE VLSI Symposium上,台积电R&D部门的Kuo-Chung Yee博士,系统披露了晶圆级系统整合技术(Wafer Scale System Integration Technology)的全景路线图。没有浮夸口号,只有冷静数据与硬核...
Source Link在半导体行业,每一次工艺突破,都会带来算力的跃迁。但当先进制程越走越窄,我们必须承认:未来真正的技术红利,可能不是来自晶体管,而是来自“整合”。在IEEE VLSI Symposium上,台积电R&D部门的Kuo-Chung Yee博士,系统披露了晶圆级系统整合技术(Wafer Scale System Integration Technology)的全景路线图。没有浮夸口号,只有冷静数据与硬核...
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