SK海力士赴美建2.5D封装厂:投资38.7亿美元,预计2028年投产

芯智讯
Dec 29, 2025

12月29日消息,据韩国媒体ZDNet Korea报导,韩国存储芯片大厂SK海力士(SK hynix)正在采取一项具备战略意义的重大投资,计划在美国印第安纳州西拉法叶(West Lafayette)建立其首条2.5D 先进封装量产线。据介绍,这座先进封装工厂是SK海力士在美国境内的首座生产基地,定位为AI内存专用的最先进封装生产基地,总投资额约为38.7亿美元,目标是在2028年下半年正式投入营运...

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