在即将到来的2026年国际消费电子展（CES）上，蓝思科技（300433.SZ ）（06613.HK）将迎来一项里程碑式的突破——全球首次公开展示其TGV（玻璃通孔）玻璃基板产品。这不仅是一次新产品的亮相，更是蓝思科技将其在玻璃领域超过三十年的深厚积累，深度赋能下一代AI算力基础设施的关键宣告。随着AI芯片算力持续爆炸式增长，传统的封装材料逐渐面临瓶颈。TGV玻璃基板凭借其卓越的平整度、优异的...
Source Link在即将到来的2026年国际消费电子展（CES）上，蓝思科技（300433.SZ ）（06613.HK）将迎来一项里程碑式的突破——全球首次公开展示其TGV（玻璃通孔）玻璃基板产品。这不仅是一次新产品的亮相，更是蓝思科技将其在玻璃领域超过三十年的深厚积累，深度赋能下一代AI算力基础设施的关键宣告。随着AI芯片算力持续爆炸式增长，传统的封装材料逐渐面临瓶颈。TGV玻璃基板凭借其卓越的平整度、优异的...
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