半导体产业在台积电带领下,正式迈入Foundry 2.0格局。 展望2026年市场关键变化,随着先进封测产能持续供不应求,在成本效率及风险分散两大考量下,订单外溢商机正逐步发酵,料将鼓舞委外封测(OSAT)链趁势崛起,扩大其在AI芯片市场的获利版图。为抢占市场先机,台系三雄日月光投控、力成、京元电,资本支出计划金额同步进入高原期,不仅加码投资扇出型面板级封装(FOPLP)等技术,更全力在中国台湾、...
Source Link半导体产业在台积电带领下,正式迈入Foundry 2.0格局。 展望2026年市场关键变化,随着先进封测产能持续供不应求,在成本效率及风险分散两大考量下,订单外溢商机正逐步发酵,料将鼓舞委外封测(OSAT)链趁势崛起,扩大其在AI芯片市场的获利版图。为抢占市场先机,台系三雄日月光投控、力成、京元电,资本支出计划金额同步进入高原期,不仅加码投资扇出型面板级封装(FOPLP)等技术,更全力在中国台湾、...
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