半导体产业已正式迈入“晶圆代工2.0”时代,这一阶段以制造、封装与测试的深度整合为特征,并在全球AI热潮的推动下实现更高质量的增长。Counterpoint Research最新发布的《按节点划分的代工收入、良率与产能利用率追踪报告》,2025年Q3全球晶圆代工2.0市场营收同比增长17%,达到848亿美元。这一两位数增长主要来自AI GPU在前端晶圆制造及后端先进封装领域的持续需求。以台积电为...
Source Link半导体产业已正式迈入“晶圆代工2.0”时代,这一阶段以制造、封装与测试的深度整合为特征,并在全球AI热潮的推动下实现更高质量的增长。Counterpoint Research最新发布的《按节点划分的代工收入、良率与产能利用率追踪报告》,2025年Q3全球晶圆代工2.0市场营收同比增长17%,达到848亿美元。这一两位数增长主要来自AI GPU在前端晶圆制造及后端先进封装领域的持续需求。以台积电为...
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