KB建滔积层板:以硬核创新领跑AI与汽车电子赛道

玻纤技术信息
Jan 08

在国际电子电路(深圳)展览会(HKPCA Show)现场,KB建滔积层板技术顾问陈锦标先生接受媒体专访,深度拆解KB在AI与汽车电子领域的技术布局、核心突破与未来规划,彰显全球覆铜板龙头的技术底气与行业远见。以下为专访内容:01AI领域:技术积淀深厚,全链条创新破局谈及AI与计算机领域的技术需求,陈锦标首先分享了KB建滔的深厚积淀:“早在十多年前,KB就与IBM达成深度合作,其覆铜板、铜箔、玻纤等...

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