先进封装火了,2026谁吃香?​

半导体产业纵横
Jan 05

本文由半导体产业纵横(ID:ICVIEWS)编译自technews中国台湾半导体产业产值预计2026年维持19%高速成长,先进封装扩产加速成拉升整体产业潜力的关键动能。全球高效能运算(HPC)与人工智能(AI)芯片需求持续井喷的情况下,共同推动半导体产业重心加速转向先进制程与先进封装领域。根据企业的最新产业展望,中国台湾半导体产业产值预计在2026 年将维持19% 的高速成长。其中,先进封装的扩产...

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