Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions

Reuters

Jan 08

Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions

Hyundai Mobis Co. Ltd. and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on the development of next-generation Software-Defined Vehicle (SDV) architectures and Advanced Driver Assistance Systems (ADAS). The partnership, formalized through an MOU signed at CES 2026, will see the two companies co-develop advanced driving and parking solutions based on Qualcomm’s Snapdragon Ride Flex system-on-chip (SoC). The collaboration aims to deliver integrated solutions tailored to emerging markets, such as India, where demand for SDV-ready architectures and ADAS is rapidly growing. Beyond ADAS, Hyundai Mobis and Qualcomm plan to expand their joint efforts to broader SDV solutions, leveraging Hyundai Mobis’s expertise in system integration and Qualcomm’s leadership in automotive chip technology.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hyundai Mobis Co. Ltd. published the original content used to generate this news brief via PR Newswire (Ref. ID: EN54998) on January 07, 2026, and is solely responsible for the information contained therein.

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{"basename":"","ssrTDKData":{"titleTemplate":"%s - Tiger Brokers","title":"Tiger Brokers | Global Stocks, Options & Futures Trading App","description":"Tiger Brokers, one-stop investment in US stocks, SGX stocks, HK stocks, A-shares & other global assets. One of the best stock trading platforms in Singapore.","keywords":"tiger brokers,tiger trade,tiger brokers singapore,broker online,stock trading in singapore,share trading singapore,brokerage firm singapore,trading app,stock broker singapore,stock trading platforms,trading account","social":{"ogDescription":"Tiger Brokers, one-stop investment in US stocks, SGX stocks, HK stocks, A-shares & other global assets. One of the best stock trading platforms in Singapore.","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/news/2601889063"},"companyName":"Tiger Brokers"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"isCrawlerRequest":true,"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2601889063\",edition:\"fundamental\",auth_exemption:1,,,undefined,":{"share":"https://ttm.financial/m/news/2601889063?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-01-08 02:00","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2601889063","market":"us","top_or_hot":-1,"title":"Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions","media":"Reuters","content":"<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        <a href=\"https://laohu8.com/S/HYPLF\">Hyundai Mobis Co. Ltd.</a> and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on the development of next-generation Software-Defined Vehicle (SDV) architectures and Advanced Driver Assistance Systems (ADAS). The partnership, formalized through an MOU signed at CES 2026, will see the two companies co-develop advanced driving and parking solutions based on Qualcomm’s Snapdragon Ride Flex system-on-chip (SoC). The collaboration aims to deliver integrated solutions tailored to emerging markets, such as India, where demand for SDV-ready architectures and ADAS is rapidly growing. Beyond ADAS, Hyundai Mobis and Qualcomm plan to expand their joint efforts to broader SDV solutions, leveraging Hyundai Mobis’s expertise in system integration and Qualcomm’s leadership in automotive chip technology.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n<i>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hyundai Mobis Co. Ltd. published the original content used to generate this news brief via PR Newswire (Ref. ID: EN54998) on January 07, 2026, and is solely responsible for the information contained therein.</span></i>\n</p>\n</div></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nHyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1032215980\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Reuters </p>\n<p class=\"h-time\">2026-01-08 02:00</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        <a href=\"https://laohu8.com/S/HYPLF\">Hyundai Mobis Co. Ltd.</a> and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on the development of next-generation Software-Defined Vehicle (SDV) architectures and Advanced Driver Assistance Systems (ADAS). The partnership, formalized through an MOU signed at CES 2026, will see the two companies co-develop advanced driving and parking solutions based on Qualcomm’s Snapdragon Ride Flex system-on-chip (SoC). The collaboration aims to deliver integrated solutions tailored to emerging markets, such as India, where demand for SDV-ready architectures and ADAS is rapidly growing. Beyond ADAS, Hyundai Mobis and Qualcomm plan to expand their joint efforts to broader SDV solutions, leveraging Hyundai Mobis’s expertise in system integration and Qualcomm’s leadership in automotive chip technology.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n<i>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hyundai Mobis Co. Ltd. published the original content used to generate this news brief via PR Newswire (Ref. ID: EN54998) on January 07, 2026, and is solely responsible for the information contained therein.</span></i>\n</p>\n</div></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4585","symbol_name":"ETF&股票定投概念","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260107:nNDL375yVK:1","article_id":"2601889063","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2601889063","pubTimestamp":1767808855,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"Hyundai Mobis Co. Ltd. and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on the development of next-generation Software-Defined Vehicle  architectures and Advanced Driver Assistance Systems . The partnership, formalized through an MOU signed at CES 2026, will see the two companies co-develop advanced driving and parking solutions based on Qualcomm’s Snapdragon Ride Flex system-on-chip . The collaboration aims to deliver integrated solutions tailored to emerging markets, such as India, where demand for SDV-ready architectures and ADAS is rapidly growing. Beyond ADAS, Hyundai Mobis and Qualcomm plan to expand their joint efforts to broader SDV solutions, leveraging Hyundai Mobis’s expertise in system integration and Qualcomm’s leadership in automotive chip technology.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generat","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"BK4585":"ETF&股票定投概念","BK4534":"瑞士信贷持仓","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","BK4141":"半导体产品","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","LU1823568750.SGD":"Fidelity Global Technology A-ACC SGD","LU1917777945.USD":"安联专题基金Cl AT Acc","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","SG9999002232.USD":"Allianz Global High Payout USD","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","BK4575":"芯片概念","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","SG9999002224.SGD":"Allianz Global High Payout SGD","LU0942090050.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD)  INC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","QCOM":"高通","LU0079474960.USD":"联博美国增长基金A","BK4515":"5G概念","BK4612":"AI芯片","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","IE00BVYPNQ40.USD":"GUINNESS ASIAN EQUITY INCOME \"C\" (USD) ACC","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","SG9999015978.USD":"利安颠覆性创新基金A","BK4579":"人工智能","LU0868494708.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) INC","SG9999001424.SGD":"United E-Commerce Fund SGD","BK4588":"碎股","BK4605":"半导体精选","IE00BVYPNP33.GBP":"GUINNESS ASIAN EQUITY INCOME \"C\" (GBP) ACC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU1261432733.SGD":"Fidelity World A-ACC-SGD","IE00BSNM7G36.USD":"NEUBERGER BERMAN SYSTEMATIC GLOBAL SUSTAINABLE VALUE \"A\" (USD) ACC","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","LU1046421795.USD":"富达环球科技A-ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","BK4598":"佩洛西持仓","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","LU1069344957.HKD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (HKD) INC","BK4573":"虚拟现实","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","HYPLF":"Hyundai Mobis Co. Ltd.","IE00BGHQDM52.EUR":"GUINNESS ASIAN EQUITY INCOME \"C\" (EUR) ACC","BK4561":"索罗斯持仓","BK4604":"机器人概念","BK4554":"元宇宙及AR概念","BK4581":"高盛持仓","BK4532":"文艺复兴科技持仓","SG9999015986.USD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (USD) ACC","BK4527":"明星科技股","BK4512":"苹果概念","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","LU1496350502.SGD":"FRANKLIN DIVERSIFIED DYNAMIC \"A\" (SGDHDG) ACC"},"translate_title":"现代摩比斯与高通合作开发下一代SDV和ADAS解决方案","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"HYPLF":1.93,"QCOM":1.93},"content_text":"Hyundai Mobis and Qualcomm Partner to Develop Next-Gen SDV and ADAS Solutions\n    \n\nHyundai Mobis Co. Ltd. and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on the development of next-generation Software-Defined Vehicle (SDV) architectures and Advanced Driver Assistance Systems (ADAS). The partnership, formalized through an MOU signed at CES 2026, will see the two companies co-develop advanced driving and parking solutions based on Qualcomm’s Snapdragon Ride Flex system-on-chip (SoC). The collaboration aims to deliver integrated solutions tailored to emerging markets, such as India, where demand for SDV-ready architectures and ADAS is rapidly growing. Beyond ADAS, Hyundai Mobis and Qualcomm plan to expand their joint efforts to broader SDV solutions, leveraging Hyundai Mobis’s expertise in system integration and Qualcomm’s leadership in automotive chip technology.\n      \n\n\nDisclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hyundai Mobis Co. Ltd. published the original content used to generate this news brief via PR Newswire (Ref. ID: EN54998) on January 07, 2026, and is solely responsible for the information contained therein.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":true,"code":"91000000","status":"200"}}}