Wai Chun Bio-Technology Signs New Loan Agreement

Reuters

Jan 06

<a href="https://laohu8.com/S/01013">Wai Chun</a> Bio-Technology Signs New Loan Agreement

Wai Chun Bio-Technology Limited has announced a delay in the despatch of a circular related to a loan agreement entered into between the company and a borrower. The circular, which will provide further details regarding the drawdowns under the agreement, was originally scheduled for release by 6 January 2026 but has been postponed to on or before 27 January 2026 to allow additional time for the preparation and finalisation of certain financial information. The company previously disclosed non-compliance with Listing Rules in connection with this transaction.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Wai Chun Bio Technology Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260106-11982175), on January 06, 2026, and is solely responsible for the information contained therein.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

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