在人工智能计算需求呈指数级增长的今天,光共封装(CPO)技术正成为解决数据中心能耗危机的关键突破口。2025年2月的国际固态电路会议(ISSCC)上,博通、英特尔和密歇根大学分别展示了革命性的CPO方案,从51.2Tbps交换芯片到1.2Tbps微LED互连,三大技术路线共同指向同一个目标:打破"功耗墙"限制。随着英伟达宣布2025年下半年推出Quantum-X光子学平台,CPO技术正式从实验室...
Source Link在人工智能计算需求呈指数级增长的今天,光共封装(CPO)技术正成为解决数据中心能耗危机的关键突破口。2025年2月的国际固态电路会议(ISSCC)上,博通、英特尔和密歇根大学分别展示了革命性的CPO方案,从51.2Tbps交换芯片到1.2Tbps微LED互连,三大技术路线共同指向同一个目标:打破"功耗墙"限制。随着英伟达宣布2025年下半年推出Quantum-X光子学平台,CPO技术正式从实验室...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.