台积电先进封装厂信息曝光!

21ic电子网
Jan 11

台积电先进封装争夺战:苹果英伟达产能博弈升级1 月 8 日,科技媒体消息显示,苹果与英伟达在台积电先进封装产能上的 “互不侵犯” 格局将被打破。此前二者技术路线泾渭分明,苹果依托 InFO 封装生产 A 系列芯片,英伟达则以 CoWoS 技术打造 GPU。点击看:重磅!全球封测一哥!日月光涨价20%!随着芯片设计复杂度提升,苹果为突破性能瓶颈,计划为 A20 芯片搭载 WMCM 封装技术,为高端 ...

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