晶盛机电、Wolfspeed同传捷报!12英寸碳化硅再迎技术突破

集邦化合物半导体
Jan 14

近期,全球碳化硅领域喜讯频传,国内与国际头部企业相继在12英寸碳化硅技术上实现关键突破。国内方面,晶盛机电子公司浙江晶瑞电子材料有限公司实现12英寸碳化硅衬底TTV≤1μm突破;国际方面,Wolfspeed宣布成功制造出单晶12英寸碳化硅晶圆。01晶盛机电实现12英寸碳化硅衬底TTV≤1μm突破1月13日,晶盛机电官微宣布,依托自主搭建的12英寸中试线,其子公司浙江晶瑞电子材料有限公司(以下简称“...

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