硅光这块肥肉,代工厂商虎视眈眈

集成电路材料创...
Jan 14

最近,联电宣布携手imec签署技术授权协议,取得imec iSiPP300 硅光子制程,该制程具备共封装光学(Co-Packaged Optics,CPO) 相容性,将加速联电硅光子技术发展蓝图。目前,联电正与多家新客户合作,预计在此平台上提供用于光收发器的光子芯片,并于2026及2027年展开风险试产。继格芯和Tower后,晶圆代工厂联电也盯上了硅光代工。01.硅光市场,一块真正的“肥肉”随着...

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