韩国芯片制造商SK海力士周二宣布,计划投资19万亿韩元(约合129亿美元)新建一座先进封装工厂,以应对人工智能技术蓬勃发展所引发的高带宽内存(HBM)需求激增。根据声明,新工厂将主要聚焦于先进封装技术,这是提升芯片性能与能效的关键环节。该设施将位于韩国清州市,依托公司现有的生产布局进行扩建。SK海力士表示,建设计划于今年4月启动,预计在2027年底完工投产,届时将大幅提升其将多个存储芯片集成至单一...
Source Link韩国芯片制造商SK海力士周二宣布,计划投资19万亿韩元(约合129亿美元)新建一座先进封装工厂,以应对人工智能技术蓬勃发展所引发的高带宽内存(HBM)需求激增。根据声明,新工厂将主要聚焦于先进封装技术,这是提升芯片性能与能效的关键环节。该设施将位于韩国清州市,依托公司现有的生产布局进行扩建。SK海力士表示,建设计划于今年4月启动,预计在2027年底完工投产,届时将大幅提升其将多个存储芯片集成至单一...
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