CES2026上HBM4的最新进展

半导体产业纵横
Jan 13

第六代HBM技术必将在人工智能设计领域掀起波澜。CES2026:高带宽内存是现代人工智能系统(尤其是运行大规模训练模型)的关键组件,也是2026年国际消费电子展(CES 2026)的焦点。美光、三星和SK海力士这三家内存厂商纷纷展示了他们的HBM4芯片。此次展会旨在宣告HBM4器件的成熟,该器件有望解决“内存墙”问题,从而突破人工智能扩展的瓶颈。HBM4有望解决内存瓶颈问题——即数据处理速度超过...

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