智通财经APP获悉，周二，联电(UMC.US)盘前大涨超14%，今年以来已累涨18%，现报10.66美元。消息面上，微芯科技旗下子公司冠捷半导体(SST)与联电共同宣布，双方已完成SST嵌入式SuperFlash第四代(ESF4)技术在UMC 28HPC+工艺平台的车规1级(AG1)全面认证并正式投产。相比其他代工厂的28纳米高K金属栅(HKMG)嵌入式闪存方案，ESF4在工艺复杂度与成本控制方面具备显著优势，为客户带来更高的制造效率与经济效益。
智通财经APP获悉，周二，联电(UMC.US)盘前大涨超14%，今年以来已累涨18%，现报10.66美元。消息面上，微芯科技旗下子公司冠捷半导体(SST)与联电共同宣布，双方已完成SST嵌入式SuperFlash第四代(ESF4)技术在UMC 28HPC+工艺平台的车规1级(AG1)全面认证并正式投产。相比其他代工厂的28纳米高K金属栅(HKMG)嵌入式闪存方案，ESF4在工艺复杂度与成本控制方面具备显著优势，为客户带来更高的制造效率与经济效益。
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