IT之家 1 月 20 日消息,据中国台湾《工商时报》报道,台积电正持续加大对先进封装技术的投资力度。随着苹果 iPhone 18 系列搭载的 A20 系列芯片转向 2nm 制程,其封装技术也将从当前的 InFO(集成扇出型封装)升级至 WMCM(晶圆级多芯片模块封装)。相较于 InFO,WMCM 的核心优势在于可在重布线层(RDL)上并行整合多颗不同功能的芯片,包括 AP 处理器、存储芯片,甚至...
Source LinkIT之家 1 月 20 日消息,据中国台湾《工商时报》报道,台积电正持续加大对先进封装技术的投资力度。随着苹果 iPhone 18 系列搭载的 A20 系列芯片转向 2nm 制程,其封装技术也将从当前的 InFO(集成扇出型封装)升级至 WMCM(晶圆级多芯片模块封装)。相较于 InFO,WMCM 的核心优势在于可在重布线层(RDL)上并行整合多颗不同功能的芯片,包括 AP 处理器、存储芯片,甚至...
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