以硅桥取代中介层:英特尔EMIB封装强调成本与设计自由度优势

爱集微
Jan 18

英特尔本周四发表的文章详细介绍了其EMIB(嵌入式多芯片互连桥)封装技术的优势,并将其与业界普遍采用的2.5D封装方案进行对比。公司强调,EMIB在成本、设计复杂度和系统灵活性方面表现更优,更适合支撑下一代高性能芯片的扩展。目前行业主流的2.5D封装方案依赖一整块硅中介层和硅通孔(TSV)来实现芯粒间的互连。英特尔指出,这种方案不仅因为使用大面积的硅中介层而推高成本,TSV工艺还可能影响整体良率,...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10