公众号记得加星标️,第一时间看推送不会错过。韩国 SK 海力士日前宣布,将投资 19 万亿韩元(约合 129 亿美元)在韩国清州市建设一座先进芯片封装工厂,项目计划于今年 4 月动工、明年底完工。这一决定,是 AI 浪潮下存储产业结构性变化的直接体现。以 HBM 为代表的高端存储,本质上是一种高度依赖 3D 堆叠与先进封装工艺的产品。无论是 TSV、微凸点,还是与 GPU、加速器的近距离互连,封装...
Source Link公众号记得加星标️,第一时间看推送不会错过。韩国 SK 海力士日前宣布,将投资 19 万亿韩元(约合 129 亿美元)在韩国清州市建设一座先进芯片封装工厂,项目计划于今年 4 月动工、明年底完工。这一决定,是 AI 浪潮下存储产业结构性变化的直接体现。以 HBM 为代表的高端存储,本质上是一种高度依赖 3D 堆叠与先进封装工艺的产品。无论是 TSV、微凸点,还是与 GPU、加速器的近距离互连,封装...
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