“HBM之父”:高带宽闪存(HBF)商业化进程超预期,或将在2-3年内集成到GPU,市场规模将超HBM

华尔街见闻
Jan 17

“HBM之父”Kim Joungho最新预测显示,高带宽闪存(HBF)商业化进程较预期明显加速,该技术有望在未来2-3年内即集成至英伟达、AMD等GPU产品中。凭借NAND堆叠带来的十倍级容量优势,HBF将填补HBM在AI推理场景的存储缺口。市场预计其将在HBM6阶段实现规模化应用,到2038年市场规模甚至可能反超HBM,成为下一代高带宽存储的关键力量。高带宽闪存(HBF)商业化进程加速,这一被...

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