智通财经APP获悉，建滔积层板(01888)现涨超5%，截至发稿，涨4.65%，报13.96港元，成交额8170.41万港元。
消息面上，因玻纤布等原料供应紧张、价格飙升，日本半导体材料厂Resonac宣布自3月1日起调涨铜箔基板（CCL）、黏合胶片等印刷电路板（PCB）材料售价、涨幅达30%以上。此外，近日有市场传言称，英伟达Rubin Ultra将弃用正交背板、改用铜缆方案，但有业内人士表示，正交背板的核心定位未发生变化。
国泰海通证券表示，2025年下半年以来，建滔8月、10月、12月月初已经提价三次，12月再次提涨，月内两次提涨超预期。意味着AI景气驱动下全产业链进入良性提价周期。公司同时布局铜箔、电子布和覆铜板，作为行业一体化龙头有望能全环节受益于涨价周期。
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