在本次的CES 2026展会上,Intel与AMD均发布了面向笔记本市场的下一代移动处理器。Intel这边拿出了代号“Panther Lake”的酷睿Ultra 300系列处理器,首次采用18A工艺,为P+E+LPE的三混合核心设计,涵盖Ultra 9/7/5系列,试图将其打造成可以覆盖轻薄本至高端性能本的核心竞争力产品。AMD则是发布了Ryzen AI 400系列APU,以及两款作为高端补充的...
Source Link在本次的CES 2026展会上,Intel与AMD均发布了面向笔记本市场的下一代移动处理器。Intel这边拿出了代号“Panther Lake”的酷睿Ultra 300系列处理器,首次采用18A工艺,为P+E+LPE的三混合核心设计,涵盖Ultra 9/7/5系列,试图将其打造成可以覆盖轻薄本至高端性能本的核心竞争力产品。AMD则是发布了Ryzen AI 400系列APU,以及两款作为高端补充的...
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