广和通亮相2026 AI硬件创新日

广和通FIBOCOM
Jan 21

广和通要闻1月16日,由硬迹(AING)与硬集谷(AINGOODS)联合主办的“2026 AI硬件创新日”在深圳南山成功举行。广和通受邀出席并系统性展示了其领先的AI全栈能力及多场景AI解决方案。 面对CES 2026释放出的行业信号,广和通与产业链上下游开发者及伙伴齐聚一堂,共同解构AI硬件从技术原型向规模化商业落地的演进路径。从CES 2026看,AI产业正经历深刻范式转移:竞争重心已从单纯的...

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