全球领先的半导体和电子产品制造解决方案供应商--ASMPTM0522.HK：
正就其表面贴装技术解决方案分部(SMT)启动策略方案评估
评估将考虑SMT之一系列选项，可能包括但不限于出售、合营、分拆及上市，或保留并支持SMT之战略发展以确保其长期成功及价值创造
摩根士丹利亚洲有限公司就评估担任本公司独家财务顾问公告全文，请点击此处
(Reporting By Alison Lui)
((alison.lui@thomsonreuters.com; +852 3462 7749))
全球领先的半导体和电子产品制造解决方案供应商--ASMPTM0522.HK：
正就其表面贴装技术解决方案分部(SMT)启动策略方案评估
评估将考虑SMT之一系列选项，可能包括但不限于出售、合营、分拆及上市，或保留并支持SMT之战略发展以确保其长期成功及价值创造
摩根士丹利亚洲有限公司就评估担任本公司独家财务顾问公告全文，请点击此处
(Reporting By Alison Lui)
((alison.lui@thomsonreuters.com; +852 3462 7749))
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