公众号记得加星标⭐️,第一时间看推送不会错过。HBF采用多层3D NAND芯片堆叠技术,与HBM互补,用于GPU。HBF 的容量是 HBM 的十倍,但速度却比 DRAM 慢。GPU 将通过分层 HBM-HBF 内存访问更大的数据集HBF的写入操作受到限制,因此软件需要专注于读取操作。人工智能工作负载的爆炸式增长给内存系统带来了前所未有的压力,迫使企业重新思考如何向加速器提供数据。高带宽内存 (...
Source Link公众号记得加星标⭐️,第一时间看推送不会错过。HBF采用多层3D NAND芯片堆叠技术,与HBM互补,用于GPU。HBF 的容量是 HBM 的十倍,但速度却比 DRAM 慢。GPU 将通过分层 HBM-HBF 内存访问更大的数据集HBF的写入操作受到限制,因此软件需要专注于读取操作。人工智能工作负载的爆炸式增长给内存系统带来了前所未有的压力,迫使企业重新思考如何向加速器提供数据。高带宽内存 (...
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