2026 年,AI 算力竞赛的焦点早已从 GPU 转移到了“内存墙”。当SK 海力士和三星(Samsung)为了争夺英伟达(NVIDIA)的下一代HBM4订单杀红了眼时,物理学给这场战争按下了一个残酷的暂停键:如何在 JEDEC 规定的 775 微米高度限制内,硬生生塞进 16 层 DRAM?答案不在光刻机里,而在封装厂里。传统的“微凸块”路线在 HBM4 时代已宣告终结。一项名为混合键合(...
Source Link2026 年,AI 算力竞赛的焦点早已从 GPU 转移到了“内存墙”。当SK 海力士和三星(Samsung)为了争夺英伟达(NVIDIA)的下一代HBM4订单杀红了眼时,物理学给这场战争按下了一个残酷的暂停键:如何在 JEDEC 规定的 775 微米高度限制内,硬生生塞进 16 层 DRAM?答案不在光刻机里,而在封装厂里。传统的“微凸块”路线在 HBM4 时代已宣告终结。一项名为混合键合(...
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