证券之星消息，根据天眼查APP于1月20日公布的信息整理，上海朗硅科技有限公司Pre-A轮融资，融资额未披露，参与投资的机构包括石雀投资，险峰长青，东方富海，金浦投资。 上海朗硅科技有限公司(以下简称“朗硅科技”)聚焦于为 AI/CPU/GPU/SoC 等高性能芯片领域客户，提供低阻抗、超薄、高密度的硅电容解决方案，满足芯片电源完整性(PI)与瞬态抑制需求。自创立以来，始终坚持自主研发，致力于打造系列化低阻抗超薄高密度硅电容产品(涵盖 7 端子、2 端子等型号，均采用 0201 封装)，目前该系列产品已凭借三维沟槽阵列 + 高 k 介质、多路径并联电极等创新技术。朗硅科技的使命是帮助国内芯片企业降低高端电容进口依赖与供应链风险，突破传统 MLCC 在容值密度、高频性能、封装厚度上的技术瓶颈，助力集成电路关键元件实现国产替代与性能升级。数据来源：天眼查APP为证券之星据公开信息整理，由AI算法生成(网信算备310104345710301240019号)，不构成投资建议。
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