在半导体产业格局重塑的关键节点,英特尔通过第四季度财报会议向市场传递了明确信号——其代工业务正凭借18A/14A先进制程与EMIB/Foveros先进封装技术组合,向台积电的统治地位发起最强冲击。首席执行官陈立武披露,基于18A工艺的首批产品已开始出货,这是美国本土开发和制造的最先进半导体工艺。更值得关注的是,客户为锁定EMIB-T先进封装产能甚至愿意预付生产费用,彰显市场对英特尔封装技术的迫切...
Source Link在半导体产业格局重塑的关键节点,英特尔通过第四季度财报会议向市场传递了明确信号——其代工业务正凭借18A/14A先进制程与EMIB/Foveros先进封装技术组合,向台积电的统治地位发起最强冲击。首席执行官陈立武披露,基于18A工艺的首批产品已开始出货,这是美国本土开发和制造的最先进半导体工艺。更值得关注的是,客户为锁定EMIB-T先进封装产能甚至愿意预付生产费用,彰显市场对英特尔封装技术的迫切...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.