在追求极致数据传输速度的光互联技术叙事中,发展方向是把光模块系统集成,以“半导体化”的方式演变为集成在芯片上的CPO方案(共封装光学)。理论上,这一范式转移将削弱传统光模块厂商的价值,将话语权转移至台积电、日月光等晶圆代工厂手中,一如在前文中提到的中际旭创的供应链地位下降。(见CES英伟达问答环节解读:关于Groq整合、供应链、和CPO的受益者展开)在CPO叙事的预期下,CPO技术将先在Scale...
Source Link在追求极致数据传输速度的光互联技术叙事中,发展方向是把光模块系统集成,以“半导体化”的方式演变为集成在芯片上的CPO方案(共封装光学)。理论上,这一范式转移将削弱传统光模块厂商的价值,将话语权转移至台积电、日月光等晶圆代工厂手中,一如在前文中提到的中际旭创的供应链地位下降。(见CES英伟达问答环节解读:关于Groq整合、供应链、和CPO的受益者展开)在CPO叙事的预期下,CPO技术将先在Scale...
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