算力航母:英特尔展示 18A 工艺 AI 芯片,背面供电 + 垂直堆叠解决能耗瓶颈

IT之家
Jan 31

IT之家 1 月 31 日消息,英特尔代工服务(Intel Foundry)本周发布技术文档,展示“AI 芯片测试载具”,用于验证其在先进封装领域的制造能力。IT之家援引博文介绍,测试载具(Test Vehicle)并非是指最终上市销售的商品,而是为了验证制造工艺、设计思路是否可行而制造出来的“工程样机”,就像汽车厂商发布的概念车或测试车。根据技术文档,该测试载具的系统级封装(SiP)拥有 8 倍...

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