在2026年1月于东京国际展览中心举办的“ NEPCON Japan 2026 ”电子制造及封装技术展览会上,英特尔公司公开展出了其下一代封装技术“玻璃芯基板”,以实物原型有力回应了此前该技术仅处于“实验室阶段”甚至“已停止研发”的传言,标志着该技术正向实际应用阶段迈出关键一步。此次亮相的是一款全尺寸原型机,尺寸为78mm x 77mm。该原型机将英特尔的2.5D封装王牌技术“EMIB(嵌入式多...
Source Link在2026年1月于东京国际展览中心举办的“ NEPCON Japan 2026 ”电子制造及封装技术展览会上,英特尔公司公开展出了其下一代封装技术“玻璃芯基板”,以实物原型有力回应了此前该技术仅处于“实验室阶段”甚至“已停止研发”的传言,标志着该技术正向实际应用阶段迈出关键一步。此次亮相的是一款全尺寸原型机,尺寸为78mm x 77mm。该原型机将英特尔的2.5D封装王牌技术“EMIB(嵌入式多...
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