阿斯麦领衔入局,先进封装设备市场竞争升级

半导体产业研究
Jan 29

在人工智能推动复杂芯片集成需求激增的背景下,全球半导体设备供应商正加速进军先进封装领域,将后端制程定位为新增长引擎。阿斯麦(ASML)、应用材料(Applied Materials)等头部厂商纷纷加码封装设备研发,扩产研发布局并并购专精企业,行业竞争格局迎来重构。一、设备巨头密集布局先进封装赛道据韩国媒体援引行业消息,全球四大半导体设备厂商——阿斯麦、应用材料、东京电子(Tokyo ...

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