点击上方蓝字关注我们软银旗下SAIMEMORY与英特尔合作,加速推进高容量、高带宽、低功耗的ZAM新型存储芯片技术,计划2027年完成原型,2029年实现商用,目标直指AI数据中心对极致算力和能效的需求。2月3日,软银集团正式对外宣布,其旗下全资子公司SAIMEMORY已与全球芯片巨头英特尔达成战略合作协议,双方将共同推进一项名为Z-Angle Memory(简称ZAM)的新型存储芯片技术的商业化...
Source Link点击上方蓝字关注我们软银旗下SAIMEMORY与英特尔合作,加速推进高容量、高带宽、低功耗的ZAM新型存储芯片技术,计划2027年完成原型,2029年实现商用,目标直指AI数据中心对极致算力和能效的需求。2月3日,软银集团正式对外宣布,其旗下全资子公司SAIMEMORY已与全球芯片巨头英特尔达成战略合作协议,双方将共同推进一项名为Z-Angle Memory(简称ZAM)的新型存储芯片技术的商业化...
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