英特尔谈先进封装的机遇!

半导体芯链
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点击“蓝字”关注我们,了解更多信息英特尔详细介绍了14A/18A芯片和先进封装技术机遇,并透露了预计到2026年下半年将陆续收到的客户订单。图片来源:英特尔在英特尔第四季度财报电话会议上,首席执行官陈立武和首席财务官大卫·津斯纳发表了几番言论,暗示晶圆代工部门正在稳步发展。英特尔预计芯片和先进封装业务将带来“数十亿美元的收入”。PART 01制程节点进展与客户样品情况在消费/数据中心人工智能(...

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