机构:2030年先进封装市场规模将达近800亿美元

满天芯
Feb 02

随着摩尔定律逼近物理极限,先进封装已取代传统制程微缩,成为驱动半导体性能提升和产业增长的核心引擎。由人工智能、数据中心及新架构主导的算力时代,正将封装技术从幕后推向产业价值创造的中心舞台。市场调查机构Yole Group研报显示,先进封装已成为推动封装市场扩张的重要力量。2024年先进封装市场达到460亿美元,较2023年回暖后同比增长19%。2030年有望超794亿美元。Yole Group预计...

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