ASML、泛林、KLA 意见一致:晶圆厂容量是芯片制造商扩产瓶颈

IT之家
Feb 02

IT之家 2 月 2 日消息,重要半导体设备制造商 ASML 阿斯麦、Lam Research 泛林、KLA 科磊上周均发布了季度财报,这三家企业在电话会议上均表示晶圆厂容量(或者说洁净室空间)是芯片制造商扩充产能以应对客户需求的瓶颈。由于晶圆厂建设过程需要 2 年乃至更长的时间,因此芯片制造商想要在短期内更充分地满足客户需求只能尽量挖掘现有产能潜力,这对半导体设备制造商而言意味着更多的升级订单。...

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