2030年半导体行业的标配不仅要拥有最先进的工艺,还要拥有尖端的先进封装技术:2.5D(CoWoS、EMIB)、3D(SoIC、Foveros、X-Cube)、混合键合、面板级封装技术(CoPoS/FOPLP)、CPO、背面电源、大尺寸玻璃基板(200mmX200mm-300mmX300m)等所有选项才能吸引客户。5月29日,无锡国际会议中心,iTGV2026扇出面板级封装合作论坛将探讨这些在矩形...
Source Link2030年半导体行业的标配不仅要拥有最先进的工艺,还要拥有尖端的先进封装技术:2.5D(CoWoS、EMIB)、3D(SoIC、Foveros、X-Cube)、混合键合、面板级封装技术(CoPoS/FOPLP)、CPO、背面电源、大尺寸玻璃基板(200mmX200mm-300mmX300m)等所有选项才能吸引客户。5月29日,无锡国际会议中心,iTGV2026扇出面板级封装合作论坛将探讨这些在矩形...
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