新增细节
路透台北2月5日 - 全球最大的芯片封装与测试服务提供商日月光投控3711.TW周四表示，预计其先进封装业务规模将在2026年翻倍至32亿美元。
营运长吴田玉在季度财报电话会议上作出上述预测。财报显示，该公司第四季度营收达1,779亿台币（56.2亿美元），同比增长9.6%，净利润增幅达58%。
日月光投控的子公司硅品精密（SPIL）是Nvidia'sNVDA.O 人工智能（AI）芯片的主要封装供应商。
财务长Joseph Tung表示，公司计划在去年34亿美元的机械设备资本支出基础上，今年再增加15亿美元；而建筑及设施投资预计将与去年21亿美元的水平持平。
Joseph Tung表示："我们将继续积极投入资本支出，以支持2026年及以后强劲的业务前景。"(完)
(编审 张涛)
((tao.zhang@thomsonreuters.com; 86-10-56692071))
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