专题：聚焦美股2025年第四季度财报
全球最大芯片封装测试厂商日月光科技控股（ASE Technology Holding）周四表示，预计其先进封装业务规模将在 2026 年翻倍，达到32 亿美元。
该表态由日月光首席运营官吴田（Tien Wu）在季度财报电话会议上作出。财报显示，公司四季度营收达新台币 1779 亿元（约 56.2 亿美元），同比增长9.6%；净利润同比大幅攀升58%。
日月光旗下子公司硅品精密工业（SPIL），是英伟达AI 芯片的核心封装供应商。
首席财务官董英哲（Joseph Tung）表示，公司计划在去年34 亿美元设备资本支出的基础上，今年再增加15 亿美元；同时，厂房及设施投资预计将维持在去年21 亿美元的相近水平。
董英哲称：“我们将继续加大资本支出力度，以支撑 2026 年及未来强劲的业务前景。”
责任编辑：郭明煜
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