中国粉体网讯近日,在东京国际展览中心举办的“NEPCON Japan 2026”电子制造及封装技术展览会上,英特尔首度公开展示集成嵌入式多芯片互连桥(EMIB,Embedded Multi-Die Interconnect Bridge)技术、尺寸达78mm×77mm的巨型玻璃芯基板原型。来源:英特尔相较于有机基板,玻璃基板凭借优异的固有特性,在先进封装等领域展现出不可替代的优势。其热膨胀系数(...
Source Link中国粉体网讯近日,在东京国际展览中心举办的“NEPCON Japan 2026”电子制造及封装技术展览会上,英特尔首度公开展示集成嵌入式多芯片互连桥(EMIB,Embedded Multi-Die Interconnect Bridge)技术、尺寸达78mm×77mm的巨型玻璃芯基板原型。来源:英特尔相较于有机基板,玻璃基板凭借优异的固有特性,在先进封装等领域展现出不可替代的优势。其热膨胀系数(...
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