特斯拉申请半导体器件封装的组装方法和装置专利,实现对封装集成电路器件的组装

市场资讯
Feb 07

国家知识产权局信息显示,特斯拉公司申请一项名为“半导体器件封装的组装方法和装置”的专利,公开号CN121488630A,申请日期为2024年7月。专利摘要显示,本公开涉及一种对封装集成电路器件进行组装的方法。该方法包括:将组装装置的支撑柱设置为用于施加管芯承载座的高度;在支撑柱处于用于施加管芯承载座的高度时,在被定位在组装装置的平台上方的半导体管芯上方施加焊料;以及将管芯承载座定位在焊料和半导体...

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