随着玻璃基板(下一代半导体封装的关键技术)的商业化进程日益临近,SK、LG和三星等公司正迅速扩大与材料和工艺供应商的合作。业内评估表明,竞争格局已从单纯的技术研发转向了以大规模生产为目标的价值链争夺战。玻璃基板是一种新一代封装技术,它以玻璃作为核心材料,取代了目前半导体封装中常用的有机基板。玻璃具有诸多优势,例如热膨胀系数低、表面平整度高(有利于精细电路的实现)、信号损耗小以及能效高。随着人工智能...
Source Link随着玻璃基板(下一代半导体封装的关键技术)的商业化进程日益临近,SK、LG和三星等公司正迅速扩大与材料和工艺供应商的合作。业内评估表明,竞争格局已从单纯的技术研发转向了以大规模生产为目标的价值链争夺战。玻璃基板是一种新一代封装技术,它以玻璃作为核心材料,取代了目前半导体封装中常用的有机基板。玻璃具有诸多优势,例如热膨胀系数低、表面平整度高(有利于精细电路的实现)、信号损耗小以及能效高。随着人工智能...
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