英伟达新一代Rubin平台正全面进入量产,业界传出,英伟达正紧锣密鼓推进下世代Rubin Ultra平台,预计今年第二季完成设计定案(Tape out),同样采用3纳米制程,但后段封装将迎来大改革,首度挑战CoWoP架构,相关设备将在今年第一季进驻硅品台中厂区,由硅品独家刀,最快第二季试产。除硅品外,此次最大变革集中在PCB上,臻鼎 - KY(4958-TW) 与欣兴 (3037-TW) 都是首波...
Source Link英伟达新一代Rubin平台正全面进入量产,业界传出,英伟达正紧锣密鼓推进下世代Rubin Ultra平台,预计今年第二季完成设计定案(Tape out),同样采用3纳米制程,但后段封装将迎来大改革,首度挑战CoWoP架构,相关设备将在今年第一季进驻硅品台中厂区,由硅品独家刀,最快第二季试产。除硅品外,此次最大变革集中在PCB上,臻鼎 - KY(4958-TW) 与欣兴 (3037-TW) 都是首波...
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