联发科率先采用台积电2纳米和14A

半导体行业观察
Feb 07

AI浪潮快速席卷全球,半导体产业结构正出现关键转折。芯片大厂联发科总经理暨营运长陈冠州指出,AI对算力、功耗与系统整合的高度需求,正全面推升先进制程与先进封装的重要性,联发科持续深化与台积电合作,在2纳米及A14制程都是首批采用客户。先进封装部分亦在COUPE(紧凑型通用光子引擎)平台助攻下,持续推进3.2T硅光子引擎。AI已从早期的感知型应用,快速进入生成式与自主式阶段,未来两至三年将进一步迈向...

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