日本公私合营半导体联盟 Rapidus 已获得约 30 家公司(包括软银和索尼)总计 1600 亿日元的额外资本贡献。随着日本加速确保先进半导体生产基地,有迹象表明全球晶圆代工竞争格局可能正在发生变化。台积电已决定在日本熊本的第二家工厂推进 3nm 半导体的量产,这将使日本首次能够在国内生产超细工艺。投资规模也显著增长,台积电在日本的设施投资已从最初的 122 亿美元扩大到 170 亿美元。...
Source Link日本公私合营半导体联盟 Rapidus 已获得约 30 家公司(包括软银和索尼)总计 1600 亿日元的额外资本贡献。随着日本加速确保先进半导体生产基地,有迹象表明全球晶圆代工竞争格局可能正在发生变化。台积电已决定在日本熊本的第二家工厂推进 3nm 半导体的量产,这将使日本首次能够在国内生产超细工艺。投资规模也显著增长,台积电在日本的设施投资已从最初的 122 亿美元扩大到 170 亿美元。...
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