在南京瑞为新材料科技有限公司的展厅里,一枚仅1/4指甲盖大小的芯片静静陈列。它的表面被一层金黄的复合材料包裹,看似普通,却藏着破解芯片散热难题的“密码”——这便是瑞为新材自主研发的金刚石/金属复合散热材料,也是我国率先实现批量化生产与应用的第三代芯片封装散热核心材料。从2021年扎根南航国际创新港孵化,到2025年获评国家级专精特新“小巨人”企业;从实验室里的技术攻关,到年均量产600多万套产品...
Source Link在南京瑞为新材料科技有限公司的展厅里,一枚仅1/4指甲盖大小的芯片静静陈列。它的表面被一层金黄的复合材料包裹,看似普通,却藏着破解芯片散热难题的“密码”——这便是瑞为新材自主研发的金刚石/金属复合散热材料,也是我国率先实现批量化生产与应用的第三代芯片封装散热核心材料。从2021年扎根南航国际创新港孵化,到2025年获评国家级专精特新“小巨人”企业;从实验室里的技术攻关,到年均量产600多万套产品...
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