三星高调布局AI内存赛道:HBM4量产落地,封装技术再谋突破

未来半导体
Feb 12

点击上方蓝字关注我们2月12日消息,2026年韩国半导体展(SEMICON Korea 2026)在首尔江南区COEX正式开幕。作为全球半导体行业的领军企业,三星电子在展会上高调亮出其进军下一代人工智能内存领域的核心战略,不仅重点强调了市场对第六代高带宽内存(HBM4)的积极反馈,还首次公布了升级版先进封装技术的详细路线图,一举一动都牵动着全球AI与半导体产业的神经。此次展会,三星将HBM4作为...

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