QuickLogic Showcases eFPGA Chiplet Solutions at Chiplet Summit

Reuters
Feb 11
QuickLogic Showcases eFPGA Chiplet Solutions at Chiplet <a href="https://laohu8.com/S/SMMT">Summit</a>

QuickLogic Corporation $(QUIK)$, a developer of embedded FPGA (eFPGA) IP and ruggedized FPGAs and chiplet solutions, will exhibit and deliver a technical presentation at Chiplet Summit 2026, taking place February 17-19, 2026, in Santa Clara, California. The company’s exhibit will be located at Booth #416, where attendees can learn about QuickLogic’s eFPGA IP and chiplet solutions for advanced heterogeneous integration. Additionally, Trey Peterson, Applications Engineer at QuickLogic, will present "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A" during Session E-202 on Thursday, February 19, from 3:00 p.m. to 4:20 p.m. Exhibit hours are Wednesday, February 18 from 12:30 p.m. to 8:00 p.m. and Thursday, February 19 from 12:00 p.m. to 3:00 p.m.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. QuickLogic Corporation published the original content used to generate this news brief via PR Newswire (Ref. ID: SF85541) on February 11, 2026, and is solely responsible for the information contained therein.

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