快科技2月1日消息，这是Intel ZAM内存首次公开展示！上周我们报道过，Intel将与软银旗下子公司Saimemory达成深度合作，联合开发名为ZAM（Z-angle memory，Z角内存）的下一代内存新技术，其单芯片最高容量可达512GB，功耗较当前主流的HBM内存降低40%至50%，意在打破HBM的垄断地位。原本以为还很遥远，没想到Intel如此之快就向全球展示了其原型产品。据日本媒体...
Source Link快科技2月1日消息，这是Intel ZAM内存首次公开展示！上周我们报道过，Intel将与软银旗下子公司Saimemory达成深度合作，联合开发名为ZAM（Z-angle memory，Z角内存）的下一代内存新技术，其单芯片最高容量可达512GB，功耗较当前主流的HBM内存降低40%至50%，意在打破HBM的垄断地位。原本以为还很遥远，没想到Intel如此之快就向全球展示了其原型产品。据日本媒体...
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